A laser ultrasonic method is proposed for the nondestructive evaluation of bonded assemblies based on the analysis of elastic plane waves reflected from the bonding interface. Plane waves are numerically synthesized from experimentally detected cylindrical waves. Several angles of incidence with respect to the bonding interface are achieved by varying the delay in the synthesis step. An inverse problem using these plane waves is then solved to identify the normal and transverse interfacial stiffnesses that model the mechanical coupling between two bonded media. The semi-analytic model developed and detailed in Hodé et al. [J. Acoust. Soc. Am. 150, 2065 (2021)] is used to create the database that contains simulated laser-generated ultrasounds required to solve the inverse problem. The developed method is first validated with semi-analytic simulated input data where Gaussian noise has been added. Next, the method is applied using signals acquired on an aluminum alloy plate and on assemblies (with and without adhesion defects) made of two aluminum alloy plates bonded by an aeronautical structural epoxy adhesive film. Differences between the identified values of interfacial stiffnesses distinguish the three samples and obtain quantitative values to characterize the adhesive bonding.