Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials.
Shim J, Bae SH, Kong W, Lee D, Qiao K, Nezich D, Park YJ, Zhao R, Sundaram S, Li X, Yeon H, Choi C, Kum H, Yue R, Zhou G, Ou Y, Lee K, Moodera J, Zhao X, Ahn JH, Hinkle C, Ougazzaden A, Kim J.
Shim J, et al. Among authors: ougazzaden a.
Science. 2018 Nov 9;362(6415):665-670. doi: 10.1126/science.aat8126. Epub 2018 Oct 11.
Science. 2018.
PMID: 30309906