Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density.
Singh N, Srivastava K, Kumar A, Yadav N, Yadav A, Dubey S, Singh R, Gehlot A, Verma AS, Gupta N, Kumar T, Wu Y, Hongyu Z, Mondal A, Pandey K, Brajpuriya R, Kumar S, Gupta R.
Singh N, et al. Among authors: srivastava k.
Nanoscale Adv. 2024 Sep 26. doi: 10.1039/d4na00578c. Online ahead of print.
Nanoscale Adv. 2024.
PMID: 39569337
Free PMC article.
Review.